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​Press Release

 

Nano OPS, Inc. and the Kostas Research Institute, Assessed "Awardable" for DARPA ERIS Marketplace, Burlington, MA.

https://www.nano-ops.net/ | https://kostas.northeastern.edu/

 

October 3, 2026 – Nano OPS, a leading provider of additive manufacturing technology for microelectronics, announced that it

has achieved "awardable" status through DARPA Expedited Research Innovation System (ERIS) Marketplace. The ERIS

submission entitled, “Nanoscale Directed Assembly for Low SWaP-C Embedded Security,” was developed in tandem with

Northeastern University’s Kostas Research Institute (KRI), which is chartered to transition fundamental to applied research for

government customers.

 

Nano OPS's solutions are designed to enable on-demand manufacturing of nano and microelectronics using directed assembly based additive technology. "We are very excited about being selected by DARPA to show case our technology on the ERIS marketplace," said Dr. Ahmed Busnaina, President and CTO of Nano OPS, Inc. “We look forward to working with DARPA and other DOW agencies on developing our solution to meet hardware security requirements for military assets.”

 

The ERIS video is accessible only by government customers with a .mil email address on the DARPA ERIS Marketplace, presents an actual use case in which the company provides a manufacturing technology that will deliver direct-write fingerprinting, encryption, and edge intelligence exactly where the signal lives – on-chip, in-package. Using the directed assembly manufacturing technique enables high throughput and nanoscale precision for making nano and microstructures for active and passive electronic devices, sensors, and more in a few days at low cost.

 

Government customers interested in viewing the video solution can create an ERIS Marketplace account at www.darpaconnect.us/eris.

 

About Nano OPS, Inc. and the Kostas Research Institute, LLC: Nano OPS’s technology enables secure and resilient micro and nanoelectronics manufacturing solutions. The high-throughput and scalable additive manufacturing using directed assembly liquid-based processes eliminates etching, vacuum deposition, and toxic chemistries. This enables rapid fabrication of transistors, logic gates, interconnects, and multilayer circuit boards down to nanoscale feature sizes. Entire circuits can be designed digitally and produced in hours. KRI personnel possess the specialized expertise required to support custom circuit and advanced device design. The technology enables the fabrication of nanoelectronics and electronic components while reducing the cost by over 10x by offering foundry-less fabrication. It also enables the heterogeneous integration of interconnected circuit layers of electronics on rigid or flexible substrates. Applications such as transistors, inverters, diodes, logic gates, NEMs switches, display, and sensors at the micro and nanoscale have been demonstrated using inorganic and organic materials. A high throughput robotic additive manufacturing platform FIBOX (Fab in a Box) fully automates deployable foundry-less directed assembly electronics on 2” to 12” diameter substrates, both rigid and flex. Nano OPS, Inc. is housed within a Northeastern University Lab at KRI.

 

For more information or media requests, contact: Dr. Ahmed A. Busnaina, Nano OPS CTO, Distinguished Professor of Mechanical and Industrial Engineering at Northeastern University: CTO@nano-ops.net | a.busnaina@northeastern.edu.  https://www.nano-ops.net/ and Dr. Caprice Gray Haley, Director of Hardware and Materials and Interim CTO, at Northeastern University’s Kostas Research Institute: c.grayhaley@kri.neu.edu | c.grayhaley@northeastern.edu. https://kostas.northeastern.edu/

 

 

About the ERIS Marketplace:

The DARPA ERIS Marketplace is a transformative digital platform designed to accelerate acquisition velocity and advance national security innovation. All 7-minute Awardable solutions housed in the Marketplace have been assessed via competitive procedures against comprehensive scoring rubric and are readily available for selection, negotiation, and award by government customers with a Marketplace account. By streamlining the procurement process, the ERIS Marketplace empowers DoW organizations to rapidly develop or acquire disruptive technologies that address the evolving challenges of defense and security. Industry and academia are encouraged to showcase their innovative solutions, connecting directly with DARPA and other government customers seeking revolutionary research and technology. Learn more at: www.darpaconnect.us/eris.

 

For media requests, please contact outreach@darpa.mil; for all other requests related to the ERIS Marketplace, please contact eris@darpa.mil.