Advancing Microelectronics Through Additive Innovation
OUR VISION
Pioneering the Future of Electronics Manufacturing
Nano OPS was founded on the belief that microelectronics can be designed and manufactured with greater speed, flexibility, and accessibility than traditional fabrication allows. As devices become smaller and more complex, legacy subtractive processes introduce unnecessary cost, rigidity, and barriers to innovation.
Our vision is to reimagine how advanced packaging, microsystems, and semiconductor structures are built—using additive methods that enable freedom of design, broader material compatibility, and rapid iteration from concept to production.
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A Service-Led Approach to Advanced Manufacturing
Our model combines deep technical collaboration with a fully automated additive platform. We work closely with engineering teams at the earliest design stages, validating concepts on real wafers before moving into scalable manufacturing.
This service-led approach reduces risk, accelerates development cycles, and ensures that each device architecture is optimized for performance, manufacturability, and long-term scalability.
WHO WE ARE
Meet Our Team
Behind every Nano OPS innovation is a team of engineers, scientists, and technologists dedicated to redefining what is possible in micro- and nanoscale manufacturing. We bring expertise in semiconductor processes, additive fabrication, materials engineering, system automation, and microsystem design—working together to build tools that empower the next generation of electronic devices.
Sudhir Jain
CEO
Sudhir leads Nano OPS with deep experience in advanced manufacturing, commercialization, and guiding complex technologies to scalable deployment.
Ahmed Busnaina
Founder & CTO
Ahmed drives the technical vision of Nano OPS, bringing decades of expertise in nanomanufacturing, materials science, and directed-assembly innovation.
Technical Team
Production
Our technical team brings specialized expertise in additive fabrication, automation, materials engineering, and semiconductor process integration.